真空热压键合机是专为微流控芯片制备而设计的,主要用于对塑料芯片(如PMMA、PC、COC等)进行键合,以实现芯片的封装和集成。
该键合机采用真空热压技术,具有高效、精确和可靠的特点,适用于各种封装和集成需求。
Vacuum Hot Press Technology:
该键合机采用真空热压技术,可以实现高质量的键合效果。真空环境可以排除空气中的气泡,防止气泡在键合过程中对芯片造成损害;
同时,热压可以让芯片之间的材料完全融合,形成牢固的键合。
Automated Control:
该键合机具有先进的自动化控制系统,可以实现键合参数的精确控制和自动化操作。
用户只需设置好键合参数,即可轻松完成键合操作,同时可以大大提高生产效率和生产质量。
High Precision and Stability:
该键合机采用高精度和高稳定性的机械和电子部件,可以实现高精度的键合操作,保证芯片之间键合质量。
同时,该键合机的稳定性也非常高,可以满足长时间连续运行的需求。
Diverse Bonding Modes:
该键合机具有多样化的键合模式,可以满足不同芯片材料和键合需求的应用。
例如,可以选择不同的温度、压力、时间等参数,以适应不同的键合材料和尺寸。
热压及键合的工作原理,其实质是通过将塑料微流控芯片加热至材料的玻璃转化温度,并施加一定压力,经过保压一定时间后,实现对芯片的热压或键合。
温度、时间、压力是热压成型和键合封装的重要工艺参数。
The bonding machine is suitable for various microfluidic chip preparation needs, especially for bonding applications involving plastic chips. This product is characterized by efficiency, precision, and reliability, providing a high-quality solution for chip preparation and packaging.
DingXu (Suzhou) Microfluidics Technology Co., Ltd. is a high-tech enterprise dedicated to the field of microfluidics. We are committed to providing customers with comprehensive microfluidic solutions, including customized microfluidic chip development, surface modification, microfluidic chip processing equipment, and microfluidic instruments. Our team boasts extensive experience and technical expertise, continuously combining professional knowledge with innovative thinking to deliver high-quality solutions. We consistently prioritize customer-centric values, embrace self-challenges, and pursue excellence. Through professionalism, innovation, and collaboration, we aim to create greater value for our customers and contribute to a brighter future in the field of microfluidics.
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