PDMS is a commonly used microfluidic chip material, its full name is polydimethylsiloxane.PDMS has the following advantages that make it a commonly used material in microfluidic chip preparation:
In conclusion, PDMS is one of the commonly used materials in microfluidic chip preparation, which has the advantages of good transparency, biocompatibility, flexibility and plasticity, and chemical resistance, providing convenience and possibility for microfluidic chip research.
The commonly used PDMS materials for microfluidic chips are Meitu RTV615 and Dow Corning Sylgard184, both of them are room-temperature curing two-component silicone rubber materials used for microfluidic chip preparation, and the main differences between them are in the following aspects:
In summary, Meto RTV615 and Dow Corning 184 are different in terms of composition, physical properties, preparation process and cost, and the appropriate material needs to be selected based on the specific application requirements.
The application of PDMS microporous membranes on organ chips is a common application. Organ chips are a platform for simulating human organs in vitro, which can be used in drug screening, disease diagnosis, tissue engineering and other fields.
PDMS 微孔膜可以作为器官芯片中的重要组成部分,用于构建微流控系统和细胞培养系统。
具体地说,PDMS 微孔膜可以用于制备组织工程支架、细胞培养板等组件,也可以作为微流控芯片中的过滤器、微分离器等元件。
例如,在肝脏芯片中,PDMS 微孔膜可以作为肝细胞培养的基质,将肝细胞培养在PDMS 微孔膜表面,利用微流控系统模拟人体肝脏内的生理环境,通过改变细胞培养条件、药物添加等方式,研究药物代谢、细胞毒性等生物学过程。
此外,PDMS 微孔膜还可以与其他材料(如纳米材料、金属材料等)结合使用,形成更复杂的组合体,用于实现更复杂的细胞培养和微流控操作。
总之,PDMS 微孔膜在器官芯片上的应用具有广泛的应用前景,可以为药物研发、疾病诊断、组织工程等领域提供重要的技术支持。
Preparation of PDMS microporous membranes
Existing PDMS films have the following specifications, whereinPDMS microporous membrane (thickness 24um, pore size 8~10um)
designation | Indicator parameters |
durometer | 65 Shore A |
tensile strength | 5.5Mpa |
tear strength | 20KN/m |
Elongation at break | 300% |
modulus of elasticity | 2.3 |
refractive index | 1.41 |
transmittance | >95%(2nm) |
operating temperature | -40~200 |
cytotoxicity | none |
dielectric strength | 12kV/mm |
Dielectric constant (kV/mm) | 2.7 |
bulk resistivity | 1014Ωcm |
Thickness Specification | 25um±2um (available with microporous, pore size 8~10um) 50um±2um 100um±2um 150um±2um 200um±2um |
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