A technique for selectively etching or stripping a semiconductor substrate surface or surface overlay film in accordance with a mask pattern or design requirements.
Etching technology is not only a fundamental manufacturing process for semiconductor devices and integrated circuits, but is also applied to thin-film circuits, printed circuits and other microfabrication.
Etching can also be categorized into wet etching and dry etching.
1 Dielectric film etching: SiNx Al2O3 and other dielectric film materials;
2 Metal etching: IBE etching of Ti, Al, Ni, Au, AuGe, Cr, Pt and other metal materials;
3 Deep silicon etching: high depth to width ratio silicon etching technique based on fluorine-based gases;
4 Other materials: etchable materials include: GaN, GaAs, InP;
© 2024. All Rights Reserved. 苏ICP备2022036544号-1