按照掩模图形或设计要求对半导体衬底表面或表面覆盖薄膜进行选择性腐蚀或剥离的技术。
刻蚀技术不仅是半导体器件和集成电路的基本制造工艺,而且还应用于薄膜电路、印刷电路和其他微细图形的加工。
刻蚀还可分为湿法刻蚀和干法刻蚀。
1 Dielectric film etching: SiNx Al2O3 and other dielectric film materials;
2 Metal etching: IBE etching of Ti, Al, Ni, Au, AuGe, Cr, Pt and other metal materials;
3 Deep silicon etching: high depth to width ratio silicon etching technique based on fluorine-based gases;
4 Other materials: etchable materials include: GaN, GaAs, InP;
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