MEMS Fabrication
顶旭微纳10年加MEMS加工经验，提供镀膜，光刻，金属，刻蚀，切割，离子注入，电子束光刻等全流程MEMS代工，助力高校、企业提升产品研发效率
MEMS Packaging Process
MEMS封装工艺 指将通过测试的晶圆按照产品型号及功能需求加工得到独立芯片的过程，涉及到的过程包括：切片（划片）、贴片、引线、键合。 我们的服务 机械划片、激光划片、阳极键合、引线键合 案例展示
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photolithography
Photolithography is the use of exposure and development techniques to etch the device structure on the photoresist layer, and then the graphics on the mask are converted to the substrate through the etching process. The main photolithography are: electron beam lithography, step lithography, contact lithography and many other photolithography techniques.
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