Epoxy resin material, suitable for casting PDMS chips, combines the precision of SU8 molds with the durability of conventional acrylic molds.
Resin molds are typically prepared by first creating PDMS chips using SU8 molds/pure silicon molds and then replicating them through PDMS molding. They offer several significant advantages:
> Epoxy resin molds can accurately replicate the microstructures of PDMS chips in a highly precise manner, maintaining the accuracy and clarity of fine features.
> Epoxy Resin molds are easy to demold, requiring no complex processing steps. They possess a reusable characteristic, greatly improving preparation efficiency and reducing costs. This feature is particularly beneficial for batch production and multiple experiments.
3、The application of resin mold significantly reduces the usage frequency of SU8 mold/pure silicon mold and effectively extends the service life of SU8 mold/pure silicon mold.
Resin molds are compared to SU-8 molds or pure silicon molds, which are not only expensive to prepare, but also cannot be repaired once damaged. In contrast, resin molds have the ability to be reused multiple times, and when damaged, they can be replicated again with a PDMS chip.
This process is simple and inexpensive, especially for PDMS chip preparation that requires mass production and multiple replications of high-precision microstructures, resin molds show a clear competitive advantage due to their excellent economy and reliability.
Structure
> Possesses a certain degree of transparency, allowing for transillumination to inspect the mold effect and internal structure.
> Resembles the shape of a silicon wafer, with a circular form, smooth upper and lower surfaces, and beveled edges.
Advantages of the Epoxy resin Mold
> No need for hydrophobic treatment, facilitating easy demolding.
> Resistant to easy fracturing
> Surface is easy to clean and can be reused.
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