The Hot Press Bonding Machine designed for the preparation of microfluidic chips is specifically used for bonding plastic chips (such as PMMA, PC, COC, etc.) to achieve chip encapsulation and integration.
This bonding machine employs vacuum hot press technology, characterized by high efficiency, precision, and reliability, making it suitable for various packaging and integration requirements.
The bonding machine has several main features:
Vacuum Hot Press Technology:
The bonding machine employs vacuum hot press technology, ensuring high-quality bonding results. The vacuum environment eliminates bubbles from the air, preventing damage to the chips during bonding.
The heat and pressure ensure complete fusion between the materials, forming a strong bond.
Automated Control:
The bonding machine has an advanced automated control system, which can realize precise control of bonding parameters and automated operation.
Users only need to set the bonding parameters, you can easily complete the bonding operation, and at the same time can greatly improve the production efficiency and production quality.
High Precision and Stability:
The machine utilizes high-precision and highly stable mechanical and electronic components, enabling high-precision bonding operations to ensure the quality of the bond between chips.
Its stability is also high, meeting the requirements of long-duration continuous operation.
Diverse Bonding Modes:
The bonding machine has diversified bonding modes to meet the application of different chip materials and bonding needs.
For example, different parameters such as temperature, pressure, and time can be selected to accommodate different bonding materials and sizes.
Working Principle:
The working principle of thermal pressing and bonding essentially involves heating plastic microfluidic chips to the glass transition temperature of the material. Applying a certain pressure and maintaining it for a specified time achieves thermal pressing or bonding.
Temperature, time, and pressure are crucial process parameters for thermal pressing and bonding.
Specifications of the Bonding Machine:
- 1）Power Supply: AC220V 50HZ, Power 3.8KW
- 2）Working Air Source: 0.5MPa—0.7MPa
- 3）Air Supply Pressure: 4-6Kgf/cm²
- 4）Control System: PLC integrated screen control system
- 5）Operating Interface: 7-inch touch screen with Chinese display
- 6）Drive Mode: Cylinder drive
- 7）Pressure Adjustment: Precision pressure valve adjustment/with back pressure control
- 8）Heating Method: Upper and lower hot plate heating with temperature controller
- 9）Pressing Area: 250x250mm250mm
- 10）Working Environment: 10—60℃, 40%—95%RH
- 11) Main body: 53cmW50cm*H93cm (slightly different according to the actual situation)
- 12） Product Weight: 160KG
The bonding machine is suitable for various microfluidic chip preparation needs, especially for bonding applications involving plastic chips. This product is characterized by efficiency, precision, and reliability, providing a high-quality solution for chip preparation and packaging.
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